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Samsung Electronics to Invest USD4.4B+ in Advanced Packaging Wafer Plant in Asan
2026-11-12 10:18:55 South Korean President Lee Jae Myung attended the groundbreaking ceremony for Samsung Electronics' wafer plant at the Onyang campus in Asan, stating that the campus will add an advanced packaging wafer plant worth KRW600 billion (approximately USD4.48 billion). This will be followed by phased additional investments totaling KRW4 trillion in high-tech equipment, with the aim of developing Asan into a core hub for high bandwidth memory (HBM) packaging. Lee said the government will mobilize all policy support to ensure the successful completion of the large-scale project. He added that this wave of innovation is rapidly spreading from Asan and Sejong to the broader Chungcheong region. Preparatory work for the commencement of memory and advanced packaging wafer plants in Cheongju, an AI data center in Dangjin, and biopharmaceutical production facilities in Osong is progressing smoothly. ~ AASTOCKS Financial News Website: www.aastocks.com | |