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SK HYNIX: Wafer Capacity to Triple by 2034; Company Reportedly Plans US ADR as Early as Aug
2026-06-11 10:17:43
SK HYNIX Chairman Chey Tae-won said that to meet surging demand for AI memory chips, the company is expanding production capacity as much as possible. Wafer capacity is expected to double within five years, and once all facilities are completed, capacity will triple by around 2034.

The first phase of four wafer fabrication plants being built by SK HYNIX in South Korea is scheduled for completion in early next year. Construction is expected to continue until 2034, ten years earlier than originally anticipated.

After completing domestic plant construction, the company will consider building more factories overseas, including in Japan, noting that Japan already has all the necessary infrastructure.

Furthermore, the U.S. Securities and Exchange Commission (SEC) may approve SK HYNIX's application to issue American Depositary Receipts (ADRs) in the U.S. during the week of June 22, Reuters, citing sources familiar with the matter, reported. SK HYNIX plans to issue ADRs in the U.S. in August.

SK HYNIX shares in South Korea hiked 1.2% to KRW2.07 million. In Hong Kong, XL2CSOPHYNIX (07709.HK) last quoted at HKD99.42, up 1.1%, with turnover of HKD4.176 billion.
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AASTOCKS Financial News
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